<?xml version="1.1" encoding="utf-8"?>
<article xsi:noNamespaceSchemaLocation="http://jats.nlm.nih.gov/publishing/1.1/xsd/JATS-journalpublishing1-mathml3.xsd" dtd-version="1.1" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"><front><journal-meta><journal-id journal-id-type="publisher-id">ME</journal-id><journal-title-group><journal-title>Modern Engineering</journal-title></journal-title-group><issn>2996-6973</issn><eissn>2996-6981</eissn><publisher><publisher-name>Art and Design</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.61369/ME.2024070015</article-id><article-categories><subj-group subj-group-type="heading"><subject>Article</subject></subj-group></article-categories><title>中国 Chiplet 技术发展路线图与产业政策建议</title><url>https://artdesignp.com/journal/ME/1/7/10.61369/ME.2024070015</url><author>李岳龙,冯明宪,钟华应,张志伟</author><pub-date pub-type="publication-year"><year>2024</year></pub-date><volume>1</volume><issue>7</issue><history><date date-type="pub"><published-time>2024-09-20</published-time></date></history><abstract>&amp;nbsp;本文深入剖析中国 Chiplet 技术的发展路线图，全面梳理其在技术演进、市场应用及产业生态建设方面的现状与趋势，并结合国际竞争格局，提出针对性产业政策建议。旨在为中国 Chiplet 技术突破发展瓶颈、提升产业竞争力、实现可持续发展提供理论支持与决策参考。</abstract><keywords>Chiplet 技术,发展路线图,产业政策,半导体产业</keywords></article-meta></front><body/><back><ref-list><ref id="B1" content-type="article"><label>1</label><element-citation publication-type="journal"><p>[1]肖勇勇.中国集成电路产业全要素生产率及影响因素的研究[D].广西大学,2021.DOI:10.27034/d.cnki.ggxiu.2021.000327.&amp;nbsp;[2]吉勇,王成迁,李杨.扇出型封装发展、挑战和机遇[J].电子与封装,2020,20(08):3-8.&amp;nbsp;[3]Mutschler A. &amp;lsquo;More than Moore&amp;rsquo; reality check [EB/OL]. Semiconductor Engineering. [2020-05-14]. Available from: http://www.semiengineering.com/more-thanmoore-reality-check.&amp;nbsp;[4]李应选.Chiplet的现状和需要解决的问题[J].微电子学与计算机,2022,39(05):1-9.&amp;nbsp;[5]Coudrain P,Charbonnier J,Garnier A,et al.Active inter‐ poser technology for chiplet-based advanced 3D system architectures[C]//2019 IEEE 69th Electronic Components&amp;nbsp;and Technology Conference(ECTC).Piscataway:IEEE Press,2019,doi:10.1109/ECTC.2019.00092.&amp;nbsp;[6]杨晖.后摩尔时代Chiplet技术的演进与挑战[J].集成电路应用,2020,37(05):52-54.&amp;nbsp;[7]王若达.先进封装推动半导体产业新发展[J].中国集成电路,2022,31(04):26-29+42.&amp;nbsp;[8]杨忠,巫强,宋孟璐,孙佳怡.美国《芯片与科学法案》对我国半导体产业发展的影响及对策研究：基于创新链理论的视角[J].南开管理评论,2023,26(01):146-160.&amp;nbsp;[9]"Chinese chip industry has to readjust to deglobalization," Digitimes, 2023. [Online]. Available: https://www.digitimes.com/news/a20230629VL200.html. [Accessed: 30June-2023].&amp;nbsp;[10]"Will the US succeed in starving China of semiconductors?," DW, 2023. [Online]. Available: https://www.dw.com/en/us-china-semiconductor/a-59251512. [Accessed:&amp;nbsp;30-June-2023].</p><pub-id pub-id-type="doi"/></element-citation></ref></ref-list></back></article>
